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Summit 750i

Summit 750i

A cost-effective and high-performance solution to address rework needs.
Summit750i can handle circuit boards up to 18 inches x 22 inches and components as small as 0201.
The rework system uses easy-to-use 1-2-3-GO software, with simple and intuitive operation. Efficient convective heating provides high heat throughput, uniformity, and repeatable rework processes. Proprietary software provides product traceability, configuration file analysis, and configuration file sharing between VJE systems.

  • Product Features

  • Technical Parameter

  • Application Area

Summit 750i is a specially designed repair system to meet the needs of users who require high-performance and advanced process control at a reasonable price.

The Summit 750i incorporates features typically found only in high-end models, including patented software with automatic temperature curve setting and an easy-to-use "1-2-3-Go" graphical user interface, ensuring maximum control over all optical, mechanical, and thermal functions of the system.

The new 750i integrates all the advantages and features of the Summit series, and introduces the latest technological innovations to meet the latest applications and challenges in the industry.


Can accommodate substrate size 18 "X20" (455mm x 508mm)

Top heating power 1.6Kw hot air focused convection

Bottom heating power 4Kw, hot air focused convection

Field of view 50 X 50 mm

Repairable component size 2X2mm to 60X60mm

6 Thermocouples can be connected to thermoelectric even numbers




All types of BGA component repairs

Repair of through-hole components

Manual and automatic tin removal system (optional)


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